The soaring demand for data services is challenging many hosters and data center operators to ensure the economic operation of their data centers, especially at high packing densities per rack.
WEISS Doppelbodensysteme is approaching this problem by developing a brand new line of product such as HydroLogic Panel.
This system is using water as cooling media in order to dissipate occurring heat.
Weiss Doppelbodensysteme GmbH now bears this challenge with the development of the system “HydroLogic Panel”.
In this system water is used as a medium for heat dissipation.
Water is channeled through the raised floor in the cold and hot aisle.
High-performance fans ensure the demand-oriented airflow, by sucking in the air from the hot aisle and blow it out in the cold aisle, in each case through the heat exchanger.
The respective elements are designed for the size 600 x 600 mm and thus fit exactly into the existing pitch of the raised floor in the data center.
Special sizes can be realized on customer request.
At a water supply temperature of 12°C and a discharge temperature of 18°C, a heat dissipation of 10 kW per plate is achieved.
HydroLogic panels can be placed in front and behind the rack for maximum heat dissipation up to 20 kW per rack.
Both, closed circuits from one rack and open circuits for multiple racks can be created.
|Power consumption||140 W|
400 W XL Version
|Air supply temprature||21° – 30°C|
|Water connector||3 / 4‘‘|
|Max Pressure||10 bar|
|Pressure loss||1 bar max|
|cooling media||Water- or glycole-water mix|
|Admeasurement||600 x 600 mm|
|Thickness||350 mm, wihtout cover|
|Topside||PVC, HPL, rubber|
|Material||steel, powder coated|
|Building Material class||A1|
|Free air outlet||39%|
|Resistance to ground|
Load bearing capacity
|Finish floor heights||500-2000 mm|